| Print | E-mail

260 is used for protecting gold finger contacts of PCB during the hot air leveling or wave soldering process. With excellent temperature resistance to 250°C / 480°F in 5 seconds. No adhesive transferred after long delay between wave soldering as well as after tape removed.

Item No Substrate Total Thickness
Adhesive Type Adhesion to Steel
260 PET + Crepe Paper 0.280 Silicone 1350


The representative products given above are only part of our products. For particular requirements,
please using EASY‐SORTING to sort out more solutions. Or submit your enquiry to Bondtec immediately.


Dah Hu Ind Zone. Unit 1,10th Fl., No. 31 Lane 169,Kang Ning St., Hsi Chih, Taipei Hsien, Taiwan
Tel : 886-2-26921478 Fax : 886-2-26921399 sales@bondtec-tape.com [ADMIN LOGIN].