260 HOT AIR LEVELING TAPE
260 is used for protecting gold finger contacts of PCB during the hot air leveling or wave soldering process. With excellent temperature resistance to 250°C / 480°F in 5 seconds. No adhesive transferred after long delay between wave soldering as well as after tape removed.
| Item No | Substrate | Total Thickness (mm) |
Adhesive Type | Adhesion to Steel (g/25mm) |
| 260 | PET + Crepe Paper | 0.280 | Silicone | 1350 |
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