260 HOT AIR LEVELING TAPE

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260 is used for protecting gold finger contacts of PCB during the hot air leveling or wave soldering process. With excellent temperature resistance to 250°C / 480°F in 5 seconds. No adhesive transferred after long delay between wave soldering as well as after tape removed.

Item No Substrate Total Thickness
(mm)
Adhesive Type Adhesion to Steel
(g/25mm)
260 PET + Crepe Paper 0.280 Silicone 1350