260

260 is used for protecting gold finger contacts of PCB during the hot air leveling or wave soldering process. With excellent temperature resistance to 250°C / 480°F in 5 seconds. No adhesive transferred after long delay between wave soldering as well as after tape removed.

附加資訊

  • 基材: 聚酯 + 美紋紙
  • Substrate: PET + Crepe Paper
  • 總厚度/Total Thickness (mm): 0.280
  • 膠系: 矽膠
  • Adhesive Type: Silicone
  • 對鋼板黏著力/Adhesion to Steel (g/25mm): 1350
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