260 is used for protecting gold finger contacts of PCB during the hot air leveling or wave soldering process. With excellent temperature resistance to 250°C / 480°F in 5 seconds. No adhesive transferred after long delay between wave soldering as well as after tape removed.
260
260用於在熱風整平或波峰焊過程中保護PCB的金手指觸點。具有在 5 秒內達到 250°C / 480°F 的出色耐溫性。在波峰焊之間以及膠帶移除後的長時間延遲後，沒有粘合劑轉移。
附加資訊
- 基材: 聚酯 + 美紋紙
- Substrate: PET + Crepe Paper
- 總厚度/Total Thickness (mm): 0.280
- 膠系: 矽膠
- Adhesive Type: Silicone
- 對鋼板黏著力/Adhesion to Steel (g/25mm): 1350
